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Low MOQ for Glue For Shoe Soles - WD8117A/B Two-Component Solventless Laminating Adhesive For Flexible Packaging – KANGDA

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Fast and good quotations, informed advisers to help you choose the correct product that suits all your needs, a short production time, responsible quality control and different services for paying and shipping affairs for Rubber Glue For Shoes, Hot Glue On Bottom Of Shoes, Wind Blade Bonding Adhesives, The concept of our corporation is "Sincerity, Speed, Services, and Satisfaction". We're going to follow this concept and gain more and far more customers' pleasure.
Low MOQ for Glue For Shoe Soles - WD8117A/B Two-Component Solventless Laminating Adhesive For Flexible Packaging – KANGDA Detail:

Characteristics and application scope of composite flexible packaging materials

The so-called composite flexible packaging, is to use more than two different properties The composite material formed by flexible packaging material, composition can give full play to each New high performance packaging with component material advantages.

Plastic flexible packaging is Refers to the composite packaging of plastic film. It can combine the advantages of each layer of film To overcome their disadvantages and combine to obtain a more desirable package Loading materials, can meet the requirements of a variety of products.

The most important characteristic of composite materials is that the composite material has excellent characteristics On the properties of the individual materials that make up the composite. The composite Packaging materials, it is in the micro structure to follow the knot Together, give play to the advantages of the composition of the substance, expand the scope of use, to High economic efficiency makes it a more practical and complete package Packing materials, the use of its excellent comprehensive performance, in order to achieve commodity package Requirements for loading.

The performance of composite packaging material is good or bad and the glue used when composite Adhesives, the choice of adhesives must consider its adhesion, Medium resistance, heat resistance, hygiene, etc. Therefore, a good Composite packaging materials can not be separated from high quality adhesive

This model improves the performance of inner layer, bringing low friction. If the bag making machine has high speed, this model will help. 

Used in laminating of various treated film like OPP, CPP, PA, PET, PE, Al etc.
This product well solves the friction problem of PE and CPP, make inner layer more smooth, which is good for bag making machine with high speed.

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Short curing time
Low coating weight
Well solve friction coefficient of PE and CPP
Long pot life≥30 min
High lamination speed can achieve 450m/min
Density(g/cm3)
A: 1.19±0.01
B: 1.14±0.01
Payment: T/T or L/C


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Low MOQ for Glue For Shoe Soles - WD8117A/B Two-Component Solventless Laminating Adhesive For Flexible Packaging – KANGDA detail pictures


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Persisting in "High quality, Prompt Delivery, Aggressive Price", we have established long-term cooperation with clientele from both equally overseas and domestically and get new and old clients' higher comments for Low MOQ for Glue For Shoe Soles - WD8117A/B Two-Component Solventless Laminating Adhesive For Flexible Packaging – KANGDA , The product will supply to all over the world, such as: Honduras, Eindhoven, Libya, Our company considers that selling is not only to gain profit but also popularize the culture of our company to the world. So we are working hard to give you the wholehearted service and willing to give you the most competitive price in the market
  • The customer service staff is very patient and has a positive and progressive attitude to our interest, so that we can have a comprehensive understanding of the product and finally we reached an agreement, thanks!
    5 Stars By Erin from Zambia - 2017.08.18 11:04
    The company's products very well, we have purchased and cooperated many times, fair price and assured quality, in short, this is a trustworthy company!
    5 Stars By Gwendolyn from Madagascar - 2017.04.28 15:45
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